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Engineering Manager








Job Type

Job Location


Engineering Manager

  • Baltic Recruitment are looking to recruit an experienced Engineering Manager to join an expanding assembly team working in a state-of-the-art production facility based in the North East of England.
  • The successful candidate will have overall responsibility for all the assembly processes after wafer fabrication, leading a team of engineers to develop and automate processes to ensure they are robust and transferable to high-volume production.

Key tasks of the Engineering Manager:

  • Lead team of engineers to develop high-yielding (>99.5%) processes across assembly for transfer to operations
  • Mentor and lead team members to evaluate interactions between equipment, modules and other process areas
  • Focus on process variation improvement in owned module to meet SPC goals and stay on the new technology roadmap
  • Transfer developed process to manufacturing with good support and documentation
  • Lead continuous improvement initiatives working closely with the Quality team

Qualifications and training of the Engineering Manager:

Degree in a technical discipline, or equivalent experience
Higher degree in technical discipline (an advantage)
SPC & CPK methodologies

Skills and experience of the Engineering Manager:

  • In-depth knowledge of SPC, FMEA, and Lean Six Sigma principles as they apply to problem solving
  • Demonstrable experience in yield analysis techniques and methodologies
  • Working knowledge of assembly processes for chip-on-flex or similar electronics packaging formats
  • Solid understanding of electrical parametric correlation to product yield
  • Industrial process engineering experience
  • Excellent communication skills, both written and verbal
  • Demonstrable ability to analyse data and draw meaningful conclusions to root cause and impact
  • Track record of ability to solve technical problems in industrial environment
  • Industrial experience in a quality conscious environment- familiarity with SPC, SOPs, ECN, POR
  • Experience of leading technical teams
  • Deep sense of data driven curiosity
  • Excellent data analysis and problem-solving skills
  • Highly motivated self-starter and able to drive progress without close supervision
  • Understanding of laser processing for chip bonding
  • Knowledge of FEOL or BEOL semiconductor processing
  • Basic device physics understanding and experience

Job Reference: BE-ENGM_1551695450


Salary per: Annum

Job Duration:

Baltic Recruitment Sector: Engineering_technical

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